The service life and long-term stability of semiconductor chips are core indicators that industrial customers and enterprise users pay most attention to. Many factors in the whole process of chip design, production, packaging and application will affect the final operating life of the product. In the R&D and design stage, reasonable circuit layout, power consumption control and heat dissipation design are the basis to ensure chip stability. In the production and manufacturing stage, advanced wafer process technology and strict quality inspection standards can effectively reduce internal defects of chips. In the actual application process, working temperature, operating voltage, electromagnetic environment and load operation status will also directly affect the service life of chips. Professional chip manufacturers will carry out multi-dimensional reliability tests before products leave the factory, optimize product performance for different application scenarios, and provide customers with high-stability, long-life semiconductor products and reliable technical support solutions.