A Multilayer PCB is aprinted circuit board containing four or more conductive copper layersseparated by insulating materials and laminated into one structure.
Compared with single-or double-sided PCBs, multilayer circuit boards provide more routing space,higher circuit density and better control of power, ground and high-speedsignals.
Antfield supportscustom multilayer PCB manufacturing from 4 to 60 layers forrobotic and other advanced electronic applications.
Multilayer PCBsintegrate signal, power and ground layers into a compact circuit board.Depending on the design, they can support:
High-speed signal transmission
Complex system control
Power distribution and management
High-density component assembly
Controlled-impedance routing
Reduced electromagnetic interference
Improved signal and power integrity
Compact electronic-system design
Antfield multilayerPCBs can be used in:
Robot main control boards
AI computing and processing modules
Motor driver and joint-control boards
Power management and BMS boards
Camera and machine-vision systems
Sensor fusion and navigation boards
CAN, Ethernet and wireless communication modules
Humanoid robots, industrial robots and AGVs
Robot dogs, service robots and medical robots
Multilayer PCBs can becustomized according to project requirements, including:
Layer count: 4–60 layers
Standard, high-Tg and low-loss materials
Controlled impedance
Blind and buried vias
Via-in-pad technology
Fine-line and fine-space designs
Heavy-copper options
ENIG, HASL, OSP and other surface finishes
Prototype and volume production
SMT and through-hole assembly support
Higher circuit and component density
Smaller overall PCB dimensions
Better signal integrity
Improved power and ground distribution
Reduced electromagnetic interference
Support for complex electronic functions
Suitable for high-speed and high-performance systems
Greater design flexibility for advanced robot electronics
Reliable multilayer PCBproduction requires careful attention to:
Layer count and stack-up
Material type and board thickness
Copper weight and copper balance
Controlled-impedance requirements
Signal, power and ground-layer arrangement
Via type and aspect ratio
Thermal management
High-speed signal integrity
Manufacturing tolerances
Complete Gerber orODB++ files, fabrication drawings, stack-up requirements and impedancespecifications should be provided before production.
Antfield reviewsproduction files and technical specifications before manufacturing. Qualitycontrols can include:
DFM and stack-up review
Material and copper-thickness verification
Inner-layer inspection
Layer-alignment checks
Lamination-process control
Hole and via inspection
Controlled-impedance testing
Electrical continuity and isolation testing
Cross-section analysis when required
Surface-finish and final appearance inspection
Production records and traceability
Antfield providescustom 4–60 layer PCB manufacturing and PCBA services for robotics, supportingprojects from prototype verification to volume production.